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Updated: Aug 15, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Addressing diffusion behavior and impact in an epoxy-amine cure system using molecular dynamics simulations
Sung Hyun Kwon1,2, Haisu Kang1, Byeong-Joo Kim3
1School of Chemical Engineering, Pusan National University, Busan, 46241, Republic of Korea.
Abstract:
To deepen understanding of diffusion-controlled crosslinking, molecular dynamics (MD) simulations are carried out by taking the diffusion image of 3,3'-diamino diphenyl sulfone (3,3'-DDS) and polyethersulfone (PES) with epoxy resin varying temperatures from 393.15 to 473.15 K over crosslinking conversion of 0-85%. The diffusion of PES and 3,3'-DDS into the bulk increased with increasing the temperature as a result of enhanced mobility of the molecules when the difference between the glass-transition temperature (Tg) and the curing temperature. Beyond the onset points of the converged crosslinking conversion ratio of 3,3'-DDS and PES, their diffusion properties are obviously restricted with crosslinking conversion ratio. At low crosslinking conversion ratios (> 10%), the diffusion coefficients of triglycidyl p-aminophenol (TGAP) were 1.1 times higher than those of diglycidyl ether of bisphenol F (DGEBF) because of the lower molecular weight of TGAP. On the other hand, the diffusion coefficients of TGAP decreased when the crosslinking ratio was up to ~ 60% because, compared with DGEBF, it had more functional groups available to react with the curing agent. At higher crosslinking ratios, the diffusion coefficients of both resins converged to zero as a result of their highly crosslinked structures.
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