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Updated: Aug 15, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Sung Hyun Kwon1,2, Haisu Kang1, Byeong-Joo Kim3
1School of Chemical Engineering, Pusan National University, Busan, 46241, Republic of Korea.
Molecular dynamics simulations reveal how temperature and crosslinking conversion affect the diffusion of epoxy resin components. Higher temperatures enhance molecular mobility, while increasing crosslinking restricts diffusion, crucial for understanding material properties.
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