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Towards Tough Thermoplastic Adhesive Tape by Microstructuring the Tape Using Tailored Defects
Ahmed Wagih1,2, Hassan A Mahmoud1,2, Ran Tao1,2
1Mechanical Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia.
Polymers
|January 21, 2023
Summary
Microstructuring conventional adhesive tapes with tailored defects significantly enhances toughness. This strategy improves material performance for demanding applications by introducing controlled flaws that guide crack propagation and deformation.
Area of Science:
- Materials Science
- Mechanical Engineering
Background:
- Conventional thermoplastic adhesive tapes often lack sufficient toughness for high-performance applications.
- Improving toughness is crucial for extending the service life and reliability of adhesive joints.
Purpose of the Study:
- To develop a strategy for enhancing the toughness of thermoplastic adhesive tapes.
- To investigate the toughening mechanisms induced by microstructured defects.
Main Methods:
- Microstructuring conventional tapes by embedding tailored defects using PTFE film.
- Experimental characterization of Mode I toughness.
- Development of a high-fidelity finite element model for simulating toughening mechanisms.
Main Results:
- The finite element model accurately described toughening mechanisms including plasticity, decohesion, and progressive damage.
- Tailored defects at the adhesive-adhesive interface promoted crack migration and controlled propagation.
- Maximum toughness improvements of 278% for Mode I and 147% for Mode II were achieved.
Conclusions:
- Microstructuring with tailored defects is an effective strategy for significantly enhancing thermoplastic adhesive tape toughness.
- The study provides insights into the mechanisms governing toughness improvement in microstructured adhesives.
- This approach offers a pathway to developing advanced adhesive materials with superior mechanical properties.
