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Sub-ps Laser Deposited Copper Films for Application in RF Guns
Antonella Lorusso1, Zsolt Kovács2, Barnabás Gilicze3
1Department of Mathematics and Physics "E. De Giorgi", University of Salento and National Institute of Nuclear Physics, 73100 Lecce, Italy.
Materials (Basel, Switzerland)
|February 11, 2023
Summary
This study demonstrates ultrashort ultraviolet laser deposition for creating copper thin films for photocathodes. This method enables fast, controlled film growth and precise patterning for advanced electronic components.
Area of Science:
- Materials Science
- Laser Physics
- Surface Science
Background:
- Copper thin films are crucial for photocathode technology.
- Efficient deposition methods are needed for fabricating these films.
Purpose of the Study:
- To investigate ultrashort UV laser deposition for copper thin films.
- To optimize film properties and patterning for photocathode applications.
Main Methods:
- Deposition of copper thin films using 600 fs laser pulses at 248 nm in a high vacuum.
- Ablation of copper targets with controlled laser parameters and ablated area.
- Characterization of film morphology, deposition rate, and material distribution.
Main Results:
- Achieved fast film growth with deposition rates up to 0.11 nm/pulse.
- Demonstrated control over material distribution and surface patterning.
- Produced well-adhering films with uniform morphology composed of lentil-like particles.
Conclusions:
- Ultrashort UV laser deposition is an effective technique for producing copper thin films.
- This method allows for task-optimized fabrication of thin film patterns with predetermined geometry.
- The developed approach is suitable for producing critical parts of photocathodes.
