Two-dimensional scanning of silicon-based focal plane array with field-of-view splicing technology

Area of Science:

• Photonics and Optical Engineering
• Solid-State Devices
• LiDAR Technology

Background:

• All-solid-state beam scanning chips offer advantages in reliability and size for next-generation LiDAR systems.
• Existing LiDAR technologies face challenges in terms of bulkiness and mechanical complexity.

Purpose of the Study:

• To propose and demonstrate a focal plane array chip for two-dimensional (2D) beam scanning.
• To utilize field-of-view splicing technology on a silicon photonics platform for enhanced scanning capabilities.

Main Methods:

• Design of a chip featuring two rotationally symmetric structures, each with a 1x64 antenna array and a 1x64 micro-ring optical switch array.
• Implementation of field-of-view splicing technology for achieving 2D scanning.
• Operation requiring only one optical switch to be activated per beam emission.

Main Results:

• Demonstration of a 2D scanning capability equivalent to an 8-line LiDAR.
• Achieved a wide field-of-view of 82° × 32°.
• Attained a narrow beam divergence angle of 0.07° × 0.07° and a background suppression ratio exceeding 20 dB.

Conclusions:

• The proposed chip provides a simple, scalable, and high-performance solution for 2D beam scanning in LiDAR applications.
• The design is scalable for achieving larger scanning ranges by incorporating more antennas and optical switches.
• This technology represents a significant advancement for compact and reliable solid-state LiDAR systems.