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Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station
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Photonic integrated circuit with multiple waveguide layers for broadband high-efficient 3D OPA.

Dachuan Wu, Bowen Yu, Venus Kakdarvishi

    Optics Letters
    |February 15, 2023
    PubMed
    Summary

    This study introduces a novel multi-waveguide-layer photonic integrated circuit (PIC) for 3D optical phased arrays (OPAs). This innovative design enhances lidar detection range and efficiency using silicon nitride/silicon dioxide stacks.

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    Area of Science:

    • Photonics
    • Integrated Optics
    • Materials Science

    Background:

    • Traditional photonic integrated circuits (PICs) are limited to single-waveguide layers due to CMOS fabrication constraints.
    • This limitation restricts the complexity and functionality of PIC-based devices.

    Purpose of the Study:

    • To explore and demonstrate a multi-waveguide-layer PIC.
    • To propose and fabricate a 3D optical phased array (OPA) device with enhanced capabilities.

    Main Methods:

    • Development of a novel multi-layer Si3N4/SiO2 stack for PIC fabrication.
    • Numerical simulations to analyze device performance.
    • Fabrication and testing of proof-of-concept multi-waveguide-layer OPA devices.

    Main Results:

    • Successful demonstration of a multi-waveguide-layer PIC configuration.
    • The proposed OPA device utilizes edge couplers for broadband, high-efficiency light coupling.
    • The unique multi-layer structure shows potential for extended detection range in lidar applications.

    Conclusions:

    • Multi-waveguide-layer PICs offer a new paradigm beyond traditional single-layer designs.
    • The demonstrated 3D OPA device paves the way for advanced photonic integrated systems.
    • This technology holds promise for improved lidar systems and other optical applications.