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Updated: Aug 9, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Dmitry V Sheglov1, Dmitry I Rogilo1, Liudmila I Fedina1
1Rzhanov Institute of Semiconductor Physics SB RAS, Lavrentiev aven. 13, Novosibirsk 630090, Russia.
Researchers developed novel silicon surface structures for nanoscale height measurements, achieving 10 pm accuracy with atomic force microscopy and improving optical interferometry precision. This innovation offers new silicon-based height gauges for metrology.
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