Constructing Sandwich-Structured Poly(vinyl alcohol) Composite Films with Thermal Conductive and Electrical...

Area of Science:

• Materials Science
• Polymer Science
• Nanotechnology

Background:

• Miniaturization in electronics increases heat dissipation challenges.
• Polymer composites offer thermal conductivity and electrical insulation but are difficult to fabricate.
• Balancing thermal and electrical properties in composites remains a significant hurdle.

Purpose of the Study:

• To create polymer composite films with coordinated thermal and electrical properties.
• To address the heat dissipation issues in microelectronic devices.
• To develop materials for high-power electronic applications.

Main Methods:

• Fabrication of sandwich-structured composite films using poly(vinyl alcohol) (PVA), boron phosphide (BP), and boron nitride nanosheets (BNNS).
• PVA/BP composite layers formed the top and bottom, with a BNNS layer in the middle.
• Tuning filler loading to optimize material properties.

Main Results:

• The composite films achieved an in-plane thermal conductivity of 9.45 W·m^-1·K^-1 at 31.92 wt % filler loading.
• Demonstrated a low dielectric constant of 1.25 at 10² Hz and excellent breakdown strength.
• Interconnected BP particles and the BNNS layer created efficient heat dissipation pathways while enhancing electrical resistivity.

Conclusions:

• The developed PVA/BP-BNNS composite films exhibit a promising balance of high thermal conductivity and electrical insulation.
• The sandwich structure effectively manages heat dissipation and electron transport.
• These composite films hold potential for applications in high-power electronic device thermal management.