Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Arbuscular mycorrhizal symbiosis decouples arsenic risk from saponin biosynthesis in Panax notoginseng (Araliaceae) by reprogramming rhizosphere and root processes.

Journal of hazardous materials·2026
Same author

Autoencoder-Enhanced Convolutional Neural Networks for Plantar Pressure-Based Gait Pattern Recognition: Model Development and Cross-Validated Evaluation Study.

JMIR formative research·2026
Same author

A Defect-Engineered Vacuum Evaporation Strategy for High-Efficiency Indoor Perovskite Mini Solar Modules.

Small methods·2026
Same author

Requirements for Human Cerebral Organoids.

Cell proliferation·2026
Same author

Prognostic Implications of Left Ventricular Ejection Fraction Improvement in Patients with Heart Failure with Reduced and Mildly Reduced Ejection Fraction.

Acta Cardiologica Sinica·2026
Same author

<i>Apilactobacillus intestinapis</i> sp. nov., isolated from the honeybee.

International journal of systematic and evolutionary microbiology·2025

Related Experiment Video

Updated: Aug 9, 2025

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
09:59

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Published on: June 23, 2018

7.8K

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer.

Yuan-Nan Tsai1,2, Shih-Chieh Chin3, Hsin-Yo Chen3

  • 1Graduate Institute of Precision Manufacturing, National Chin-Yi University of Technology, Taichung 411030, Taiwan.

ACS Omega
|February 23, 2023
PubMed
Summary

Researchers optimized sputtering to create anti-reflection (AR) layers on polyimide (PI) for reliable flexible circuits. This process enhances copper adhesion and lowers reflectance, enabling advanced electronic applications.

More Related Videos

Fabrication of Ultra-thin Color Films with Highly Absorbing Media Using Oblique Angle Deposition
06:30

Fabrication of Ultra-thin Color Films with Highly Absorbing Media Using Oblique Angle Deposition

Published on: August 29, 2017

8.3K
Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
08:50

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

Published on: September 2, 2015

8.9K

Related Experiment Videos

Last Updated: Aug 9, 2025

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
09:59

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Published on: June 23, 2018

7.8K
Fabrication of Ultra-thin Color Films with Highly Absorbing Media Using Oblique Angle Deposition
06:30

Fabrication of Ultra-thin Color Films with Highly Absorbing Media Using Oblique Angle Deposition

Published on: August 29, 2017

8.3K
Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management
08:50

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

Published on: September 2, 2015

8.9K

Area of Science:

  • Materials Science
  • Surface Engineering
  • Thin Film Deposition

Background:

  • Transparent polyimide (PI) films are crucial for flexible electronics.
  • Achieving reliable adhesion between PI substrates and conductive layers is challenging.
  • Low reflectance is desirable for optical applications in flexible devices.

Purpose of the Study:

  • To optimize DC-reactive magnetron sputtering parameters for depositing anti-reflection (AR) layers on PI substrates.
  • To enhance the adhesion strength between the AR-coated PI substrate and a subsequently deposited copper layer.
  • To fabricate reliable composite films for advanced flexible circuits with low reflectance.

Main Methods:

  • Optimized DC-reactive magnetron sputtering parameters for AR layer deposition.
  • Controlled deposition thickness and adjusted gas composition during sputtering.
  • Conducted adhesion reliability tests, including peel strength measurements.
  • Investigated the effect of thermal processing on film morphology and adhesion.

Main Results:

  • Achieved low reflectance on AR layer-coated PI films.
  • Significantly improved adhesion strength between the PI film and the copper layer.
  • Demonstrated further enhancement in peel strength after thermal processing due to worm-like morphology.
  • Successfully fabricated reliable composite films with desirable properties.

Conclusions:

  • Optimized sputtering parameters enable the fabrication of reliable composite films for flexible circuits.
  • The developed AR layer-coated PI substrate exhibits low reflectance and excellent adhesion to copper.
  • Thermal processing enhances adhesion through improved mechanical interlocking, confirming the material's reliability.