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Thermal Characterisation of Hybrid, Flip-Chip InP-Si DFB Lasers.

David Coenen^1,2, Huseyin Sar², Herman Oprins²

¹Department of Materials Engineering, KU Leuven, 3000 Leuven, Belgium.

|February 25, 2023

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This study analyzes the thermal performance of hybrid Indium Phosphide-Silicon Distributed Feedback (DFB) lasers. Direct heat sink attachment to the laser

Area of Science:

Optoelectronics
Semiconductor Lasers
Thermal Management

Background:

Hybrid integration of Indium Phosphide (InP) and Silicon (Si) devices offers advanced functionalities.
Distributed Feedback (DFB) lasers are crucial components in optical communication systems.
Effective thermal management is essential for the performance and reliability of integrated photonic devices.

Purpose of the Study:

To conduct a detailed thermal analysis of a hybrid, flip-chip InP-Si DFB laser.
To experimentally determine the thermal performance characteristics of the laser.
To develop and validate thermal models for predicting laser temperature and optimizing thermal design.

Main Methods:

Experimental testing of InP-Si DFB lasers at various operating temperatures.

Keywords:

hybrid laser integration silicon photonics thermal characterisation thermal modelling

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Derivation of thermal performance metrics including threshold current, lasing slope, and output spectrum dependence on temperature.

Calculation of laser thermal resistance (R_th).

Development and application of thermal finite element models for sensitivity analysis.

Main Results:

The laser thermal resistance was calculated to be 75.9 K/W.
Thermal finite element models were validated using experimental data.
A sensitivity study identified key factors influencing laser temperature.
Multiple strategies for reducing thermal resistance and thermal coupling were investigated.

Conclusions:

Direct attachment of a heat sink to the laser's top surface is the most effective method for reducing operating temperature.
Optimized thermal management is critical for enhancing the performance of hybrid InP-Si DFB lasers.
The presented thermal analysis and modeling provide valuable insights for future device design and integration.