Preparation of Highly Stable Polymer Microstructure with Enhanced Adhesion Strength by Pushpin-like...

This polymer microstructure expands more available application, which is a milestone for the development of micro-electro-mechanical system devices towards intelligence and multifunction. Poor interface bonding between the polymer and Si or metal is a particular problem, which restricts the application and promotion of polymer materials. In this study, a transition strengthening layer is proposed to obtain a highly stable polymer microstructure by enhancing the interfacial adhesion strength. The transition strengthening layer is activated by a pushpin-like nano/microstructure array with micromachining technology. Given its good graphical qualities and compatibility, epoxy negative photoresist SU-8 is applied to evaluate the strengthened capabilities of the pushpin-like nano/microstructure array. The microstructure of SU-8 is prepared by the same processes, and then the adhesion strength between the SU-8 microstructure and various activated substrates is tested by the thrust tester. It was determined that SU-8 with an activated pushpin-like microstructure array possessed a highly stable adhesion ability, and its adhesion strength increased from 6.51 MPa to 15.42 MPa. With its ultrahigh stable adhesion ability, it has been applied in fabricating three typical microstructures (hollow square microstructure, gradually increasing adjacent periodic microstructure, and slender strip microstructures) and large-area SU-8 microstructures to evaluate the feasibility of the transition strengthening layer and repeatability and universality of the microfabrication processes. The drifting and gluing phenomenon are avoided by this method compared with the traditional design. The proposed pushpin-like nano/microstructure array is promising in enhancing the stability of polymer microstructures with a substrate.