A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance

Area of Science:

• Materials Science
• Polymer Chemistry
• Nanotechnology

Background:

• Silver pastes are crucial for flexible electronics due to their conductivity and printability.
• Limited research exists on silver pastes with high heat resistance and detailed rheological properties.
• Developing advanced materials for demanding electronic applications is an ongoing challenge.

Purpose of the Study:

• To synthesize and characterize novel nano silver pastes with superior heat resistance.
• To investigate the rheological properties and their impact on printability.
• To evaluate the potential of these pastes in high-resolution flexible electronics manufacturing.

Main Methods:

• Synthesis of fluorinated polyamic acids (FPAA) via polymerization.
• Preparation of nano silver pastes by mixing FPAA resin and nano silver powder.
• Improvement of nano silver dispersion using three-roll grinding.
• Characterization of thermal resistance, electrical resistivity, and thixotropic performance.

Main Results:

• Nano silver pastes exhibit excellent thermal resistance, with a 5% weight loss temperature exceeding 500 °C.
• A volume resistivity of 4.52 × 10^-7 Ω·m was achieved at 83% silver content and 300 °C curing temperature.
• The pastes show high thixotropic performance, enabling high-resolution pattern fabrication.

Conclusions:

• The developed nano silver pastes offer a compelling combination of electrical conductivity, high heat resistance, and thixotropy.
• These properties make them highly suitable for flexible electronics manufacturing, particularly in high-temperature environments.
• The material shows significant potential for advanced applications in the field of flexible electronics.