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Dispersion engineering of spoof plasmonic metamaterials via interdigital capacitance structures
Optics Letters
|March 22, 2023
Summary
This study introduces spoof plasmonic metamaterial dispersion engineering using interdigital capacitance for tunable cutoff frequencies. This approach enables compact microwave devices, reducing size by 50% compared to substrate-integrated waveguides.
Area of Science:
- Metamaterials
- Plasmonics
- Microwave Engineering
Background:
- Spoof surface plasmon polaritons (SSPPs) offer unique electromagnetic properties for microwave applications.
- Controlling dispersion and cutoff frequencies in SSPP structures is crucial for device design.
- Existing methods for dispersion engineering often face limitations in compactness and tunability.
Purpose of the Study:
- To present a novel approach for dispersion engineering of spoof plasmonic metamaterials.
- To achieve controllable cutoff frequencies using interdigital capacitance structures.
- To develop a compact SSPP transmission line (TL) with enhanced performance.
Main Methods:
- Utilizing interdigital capacitance structures to construct unit cells for metamaterials.
- Analyzing dispersion properties and the influence of geometrical parameters on cutoff frequencies.
- Designing and simulating a smooth transition for the SSPP TL.
- Validating the proposed strategy through simulation and measurement of transmission characteristics.
Main Results:
- Demonstrated joint tuning of lower and upper cutoff frequencies via interdigital capacitance.
- Achieved a significant reduction in transversal dimension (by a factor of two) compared to substrate-integrated waveguide (SIW) designs.
- Successfully developed and validated an SSPP TL with controllable dispersion.
Conclusions:
- The proposed interdigital capacitance approach provides effective dispersion engineering for spoof plasmonic metamaterials.
- This method enables the creation of highly tunable and compact microwave devices.
- The findings accelerate the development of versatile microwave integrated circuits and systems.

