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Residual Stresses

Residual Stresses

Residual stresses reside in a structure even after removing the original stress inducer. This phenomenon often arises from varied plastic deformations across different parts of a structure. Consider a rod stretched beyond its yield point. It will not regain its original length due to permanent deformation. Even after load removal, the rod does not entirely lose stress because of uneven plastic deformations, resulting in residual stresses. The computation of these stresses in structures is...

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Related Experiment Video

Updated: Aug 5, 2025

Using Laser Scanning Microscopy to Determine Electromigration in Molybdenum Disilicide

Using Laser Scanning Microscopy to Determine Electromigration in Molybdenum Disilicide

Published on: May 23, 2025

The Study of the Reliability of Complex Components during the Electromigration Process.

Hao Cui¹, Wenchao Tian¹, Yiming Zhang¹

¹School of Electro-Mechanical Engineering, Xidian University, Xi'an 710000, China.

|March 29, 2023

Summary

This summary is machine-generated.

Electromigration (EM) failures in electronic components are rising. This study combined simulation and experiments to analyze EM in complex components, improving reliability predictions.

Keywords:

MTTF electromigration life prediction reliability void formation

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Last Updated: Aug 5, 2025

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In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Published on: June 26, 2015

Area of Science:

Materials Science
Electrical Engineering
Reliability Engineering

Background:

Increasing input/output density and decreasing interconnection spacing exacerbate electromigration (EM) failures.
Understanding EM failure mechanisms in complex components is crucial for device reliability.

Purpose of the Study:

To investigate the electromigration reliability and failure mechanisms of complex electronic components.
To overcome limitations of micro-scale experimental measurements through simulation and experimentation.

Main Methods:

Combined simulation and experimental approaches to study electromigration.
Utilized atomic flux divergence method for void formation prediction.
Conducted experiments following IPC-9701A guidelines.

Main Results:

Simulation revealed significant current crowding at solder joint inlets, enhancing EM effects.
Experimental results showed increased resistance due to void formation and lead corrosion.
Observed promotion of intermetallic compound growth under current stress, with composition changes and crack formation in Cu3Sn layers.

Conclusions:

Atomic flux divergence method enables accurate void prediction and life assessment, surpassing Black's equation.
Electromigration significantly impacts solder joint integrity and intermetallic compound formation.
Determined a mean time to failure of 1065 hours under specific test conditions (1.4 A, 125 °C).