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Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by

Xingwang Hu1, Li Liu2, Sheng Liu1

  • 1The Institute of Technological Sciences of Wuhan University, Wuhan University, Wuhan 430072, China.

Micromachines
|March 29, 2023
PubMed

Keywords:
ball grid arraymacro voidssolder jointtemperature cycling testthermal fatigue reliability

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