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Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect.

Wenting Su1, Wenzhong Lou1, Hengzhen Feng1

  • 1Science and Technology on Electromechanical Dynamic Control Laboratory, School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China.

Micromachines
|March 29, 2023
PubMed
Summary
This summary is machine-generated.

This study introduces a microelectromechanical systems (MEMS) solid-state logic control chip for miniaturized fuses. Experiments show a minimum electrical explosion voltage of 23.6 V, with partial bridge vaporization observed under specific conditions.

Keywords:
MEMSmetal bridgesolid-state ON–OFF switchsolid-state fuse logic control chip

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Area of Science:

  • Solid-state physics
  • Microelectromechanical systems (MEMS) engineering

Background:

  • Miniaturization and integration of fuses are critical for advanced electronic devices.
  • Existing fuse technologies face limitations in size and performance.

Purpose of the Study:

  • To design and validate a microelectromechanical systems (MEMS) solid-state logic control chip for fuse applications.
  • To investigate the thermal and electrical characteristics of the MEMS fuse.

Main Methods:

  • Development of a three-layer MEMS chip: diversion, control, and substrate layers.
  • Establishment of a mathematical model based on the heat conduction equation.
  • Finite element multi-physical field simulation for performance analysis.
  • Experimental testing including constant current, maximum current resistance, and electrical explosion voltage tests.

Main Results:

  • The MEMS solid-state fuse-logic control chip was fabricated using surface silicon processing.
  • A minimum electrical explosion voltage of 23.6 V was determined for a bridge area of 200 × 30 μm.
  • Theoretical calculations and experimental results indicate partial vaporization of the bridge area at 20 V and 100 μF.

Conclusions:

  • The designed MEMS solid-state logic control chip meets fuse miniaturization and integration requirements.
  • The study validates the performance and limitations of the MEMS fuse under electrical stress.
  • The findings provide a foundation for further development of advanced MEMS-based protection devices.