Semiconductors
Metal-Semiconductor Junctions
Types of Semiconductors
Biasing of Metal-Semiconductor Junctions
Non-ohmic Devices
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Updated: Aug 4, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
Wen-Qi Wei1,2, An He3, Bo Yang1,4
1Institute of Physics, Chinese Academy of Sciences, Beijing, China.
Researchers achieved monolithic integration of InAs/GaAs quantum dot lasers on silicon-on-insulator (SOI) substrates. This breakthrough enables scalable, cost-effective on-chip light sources for dense photonic integration.
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