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E-Textile by Printing an All-through Penetrating Copper Complex Ink.

Yousef Farraj¹, Aviad Kanner¹, Shlomo Magdassi¹

¹Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, 91904 Jerusalem, Israel.

ACS Applied Materials & Interfaces

|April 19, 2023

Summary

Researchers developed a new method for creating durable, stretchable electronic textiles (e-textiles) using a unique copper complex ink. This process ensures reliable circuits for wearable devices, overcoming limitations of current nanoparticle inks.

Keywords:

copper complex copper ink e-textile printed electronics wearable electronics

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Area of Science:

Materials Science
Textile Engineering
Electrical Engineering

Background:

Wearable electronics and electronic textiles (e-textiles) require robust electrical circuits capable of withstanding mechanical stress.
Conventional nanoparticle-based conductive inks for e-textiles lack sufficient durability and reliability due to thin conductor layers.
There is a need for advanced fabrication methods to produce highly stretchable and durable e-textiles.

Purpose of the Study:

To develop a novel process for fabricating robust and stretchable e-textiles.
To utilize a solution-based copper complex ink for full fabric penetration and circuit formation.
To enhance the conductivity, stretchability, and durability of printed electronic circuits on textiles.

Main Methods:

Fabrication of stretchable e-textiles using a thermodynamically stable, solution-based copper complex ink.
Printing the ink onto knitted stretchable fabrics, followed by thermal treatment to induce self-reduction.
Utilizing the formed metallic copper as a seed layer for subsequent electroless plating (EP) to create conductive circuits.

Main Results:

The process enabled full penetration of the ink into the fabric, forming a robust conductor.
Electroless plating resulted in highly conductive copper circuits on the stretchable fabric.
The study identified that the stretching direction significantly influences the resistivity of the circuits.
The fabricated e-textiles demonstrated high stretchability and durability, suitable for applications like wearable gloves.

Conclusions:

The novel copper complex ink and fabrication process provide a viable method for producing highly stretchable and durable e-textiles.
This approach overcomes the limitations of conventional inks, offering improved reliability for wearable electronic applications.
The developed technique paves the way for printing functional e-textiles with enhanced performance characteristics.