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Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper
Maxence Menétrey1, Cathelijn van Nisselroy2, Mengjia Xu2
1Laboratory for Nanometallurgy, Department of Materials, ETH Zürich Vladimir-Prelog-Weg 1-5/10 8093 Zürich Switzerland ralph.spolenak@mat.ethz.ch.
RSC Advances
|May 8, 2023
Summary
Researchers explored micro-scale copper interconnects using advanced printing methods. They found that printing strategies significantly impact electrical properties, enabling control over resistivity for microelectronics.
Area of Science:
- Materials Science
- Microelectronics Engineering
- Additive Manufacturing
Background:
- The demand for higher device density in microelectronics drives the need for advanced manufacturing techniques.
- Current micro- and nano-scale additive manufacturing (AM) methods offer design freedom but lack device-grade materials.
- Understanding the link between processing and material properties is crucial for developing new electronic components.
Purpose of the Study:
- To investigate the electrical properties of micrometer-scale copper interconnects fabricated using Fluid Force Microscopy (FluidFM) and Electrohydrodynamic-Redox Printing (EHD-RP).
- To establish a novel 4-terminal testing chip for direct electrical characterization of as-printed micro-scale metals.
- To correlate printing strategies and resulting microstructures with the electrical resistance and resistivity of copper interconnects.
Main Methods:
- Fabrication of micrometer-scale copper interconnects using FluidFM and EHD-RP.
- Development and utilization of a specialized thin film-based 4-terminal testing chip for in-situ electrical resistance measurements.
- Analysis of the relationship between printing parameters, material morphology, microstructure, and electrical performance.
Main Results:
- Direct correlation established between print strategies, microstructural features, and the electrical resistance of as-printed copper interconnects.
- Demonstrated the first-time direct synthesis of conductive structures on an insulating substrate using FluidFM.
- Showcased the ability of EHD-RP to precisely tune copper's resistivity over an order of magnitude by adjusting printing voltage.
Conclusions:
- The study provides critical insights into the electrical properties of micro- and submicrometer-scale copper interconnects fabricated by advanced AM techniques.
- The developed electrical characterization approach is vital for understanding and optimizing micro-AM metal properties.
- Findings pave the way for improved design and fabrication of advanced electronic components using micro-scale additive manufacturing.
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