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Published on: October 6, 2019
Correction of Rotational Eccentricity Based on Model and Microvision in the Wire-Traction Micromanipulation System
Yuezong Wang1, Daoduo Qu1, Shengyi Wang1
1Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China.
This study introduces a novel method to measure and correct coil eccentricity in automatic wire-traction micromanipulation systems. The technique enhances control accuracy for precise micron-level wire manipulation.
Area of Science:
- Robotics and Automation
- Mechanical Engineering
- Microtechnology
Background:
- Automatic wire-traction micromanipulation systems require high precision.
- Coil-to-rotation axis misalignment causes eccentricity, impacting control accuracy.
- Micron-level manipulation of electrode wires is susceptible to eccentricity errors.
Purpose of the Study:
- To propose a method for measuring and correcting coil eccentricity in micromanipulation systems.
- To improve the control accuracy of wire-traction systems.
- To enhance the efficiency and applicability of micromanipulation and microassembly.
Main Methods:
- Established models for radial and tilt eccentricity based on identified sources.
- Developed a measurement technique combining an eccentricity model with microscopic vision.
- Implemented a correction strategy using a compensation model and hardware adjustments.
- Utilized visual image processing algorithms for model parameter calibration.
Main Results:
- Models accurately predicted eccentricity, with root mean square error (RMSE) used for evaluation.
- The correction method effectively reduced residual errors to within 6 μm.
- Achieved approximately 99.6% compensation for eccentricity.
- Experimental results validated the accuracy of prediction and effectiveness of correction.
Conclusions:
- The proposed method integrates eccentricity modeling and microvision for precise measurement and correction.
- This approach significantly improves wire-traction micromanipulation accuracy and system efficiency.
- The developed technique offers a more suitable and wider range of applications in micromanipulation and microassembly fields.
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