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A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Haoyu Wang1, Jianshe Ma1, Yide Yang1

  • 1Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China.

Micromachines
|June 28, 2023
PubMed

Keywords:
advanced packagingintegrated circuitsoptimizationpackage reliabilitysystem-in-package

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There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
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