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    Silicon photonics enables higher data rates but faces slow optical packaging. A new CO2 laser fusion splicing technique attaches fiber arrays to photonic chips in one shot, reducing costs and improving efficiency.

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    Area of Science:

    • Photonics
    • Materials Science
    • Optical Engineering

    Background:

    • The data communications (datacom) and telecommunications (telecom) industries require higher data rates, driving adoption of silicon photonics.
    • Silicon photonics offers higher data rates and reduced manufacturing costs but optical packaging remains a bottleneck.
    • Current optical packaging methods for integrated photonic devices are slow and expensive.

    Purpose of the Study:

    • To introduce a novel, efficient optical packaging technique for integrated photonic devices.
    • To demonstrate a single-shot CO2 laser fusion splicing method for attaching fiber arrays to photonic chips.
    • To evaluate the coupling loss performance of the proposed technique.

    Main Methods:

    • Development of a CO2 laser fusion splicing process for optical packaging.
    • Attachment of 2, 4, and 8-fiber arrays to photonic chips in a single laser shot.
    • Characterization of coupling losses for different fiber array configurations.

    Main Results:

    • Successful fusion splicing of fiber arrays to oxide mode converters using a single CO2 laser shot.
    • Achieved minimum per-facet coupling losses of 1.1 dB for 2-fiber arrays, 1.5 dB for 4-fiber arrays, and 1.4 dB for 8-fiber arrays.
    • Demonstrated the viability of CO2 laser fusion splicing as a rapid optical packaging solution.

    Conclusions:

    • CO2 laser fusion splicing is an effective and efficient method for optical packaging of silicon photonic devices.
    • The single-shot technique significantly reduces the time and cost associated with optical packaging.
    • This advancement facilitates the scalable manufacturing of high-density photonic integrated circuits.