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Passive alignment platform for electro-optic, photonic, and micro-optic systems.

Sushant Kumar, Jaime Cardenas

|December 19, 2025

Summary

This summary is machine-generated.

This study introduces a passive alignment platform for scalable chiplet integration, enabling fast and reliable assembly of electro-optic systems. This method overcomes the limitations of active alignment, reducing cost and complexity for advanced electronic and photonic packaging.

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Area of Science:

Photonics and Electronics Integration
Semiconductor Packaging Technologies
Nanoscale Alignment Systems

Background:

Large-scale integration of chiplet-based systems is crucial for future photonic and electronic applications.
Current nanometer-level alignment methods (active alignment) are slow and expensive, hindering scalability.
A need exists for efficient and cost-effective passive alignment solutions.

Purpose of the Study:

To develop a passive alignment platform for fast, reliable, and scalable assembly of electro-optic systems.
To demonstrate the feasibility of passive alignment for chip-to-chip optical interconnects.
To reduce the cost and complexity associated with high-precision chip assembly.

Main Methods:

Development of a wafer-scale passive alignment platform utilizing an elastic-averaging scheme.
Fabrication of alignment structures on the back of chips.
Characterization of chip-to-chip alignment accuracy and optical link loss.

Main Results:

Achieved 260 nm lateral alignment and 240 nm height alignment between chips.
Demonstrated a chip-to-chip optical link loss of -2.4 dB.
The elastic-averaging scheme provided a robust passive alignment solution.

Conclusions:

The developed passive alignment platform enables fast, reliable, and scalable assembly of electro-optic systems.
This approach offers a cost-effective alternative to active alignment for chiplet integration.
The technology is suitable for large-scale implementation in advanced photonic and electronic packaging.