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Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using

Martin Hubmann1, Mona Bakr2, Jonas Groten3

  • 1Polymer Processing, Department of Polymer Engineering and Science, Montanuniversitaet Leoben, 8700 Leoben, Austria.

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Summary
This summary is machine-generated.

Component detachment during injection molding of assembled foils is a significant challenge. Optimizing molding parameters is crucial for damage-free manufacturing of these electronic components.

Keywords:
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Area of Science:

  • Materials Science
  • Manufacturing Engineering
  • Polymer Science

Background:

  • Assembled foils with printed circuit boards and electronic components are integrated into injection-molded parts.
  • Electronic components risk detachment during overmolding due to high pressures and shear stresses from molten thermoplastic.
  • Manufacturing process parameters critically influence the successful, damage-free integration of these components.

Purpose of the Study:

  • To investigate the influence of injection molding parameters on the detachment of electronic components from assembled foils.
  • To compare simulation results with experimental data for validation.
  • To assess the limitations of standard mechanical testing for predicting in-process failure.

Main Methods:

  • A virtual parameter study using injection molding simulation software.
  • Experimental injection molding tests with 1206-sized components overmolded in polycarbonate (PC).
  • Mechanical testing including shear and peel tests at room temperature.

Main Results:

  • Simulated forces increased with decreasing mold thickness and melt temperature, and increasing injection speed.
  • Calculated tangential forces ranged from 1.3 N to 7.3 N.
  • Experimental shear forces at break (≥22 N) were higher than simulated forces, yet component detachment occurred in most experimental parts.

Conclusions:

  • Standard room temperature shear tests provide limited insight into component detachment during overmolding.
  • The complex loading conditions during overmolding, potentially including peel-like stresses, are not fully captured by simple shear tests.
  • Further research is needed to understand and mitigate component detachment under realistic overmolding conditions.