A fast tomosynthesis method for printed circuit boards based on a multiple multi-resolution reconstruction algorithm

Digital tomosynthesis (DTS) technology has attracted much attention in the field of nondestructive testing of printed circuit boards (PCB) due to its high resolution and suitability to thin slab objects. However, the traditional DTS iterative algorithm is computationally demanding, and its real-time processing of high-resolution and large volume reconstruction is infeasible. To address this issue, we in this study propose a multiple multi-resolution algorithm, including two multi-resolution strategies: volume domain multi-resolution and projection domain multi-resolution. The first multi-resolution scheme employs a LeNet-based classification network to divide the roughly reconstructed low-resolution volume into two sub-volumes namely, (1) the region of interest (ROI) with welding layers that necessitates high-resolution reconstruction, and (2) the remaining volume with unimportant information which can be reconstructed in low-resolution. When X-rays in adjacent projection angles pass through many identical voxels, information redundancy is prevalent between the adjacent image projections. Therefore, the second multi-resolution scheme divides the projections into non-overlapping subsets, using only one subset for each iteration. The proposed algorithm is evaluated using both the simulated and real image data. The results demonstrate that the proposed algorithm is approximately 6.5 times faster than the full-resolution DTS iterative reconstruction algorithm without compromising image reconstruction quality.