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Updated: Jul 23, 2025

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices

Published on: June 26, 2015

Interface microstructure effects on dynamic failure behavior of layered Cu/Ta microstructures.

Rajesh Kumar^1,2, Jie Chen¹, Avanish Mishra^1,3

¹Department of Materials Science and Engineering, Institute of Materials Science, University of Connecticut, 97 North Eagleville Road, Unit 3136, Storrs, CT, 06269-3136, USA.

Scientific Reports

|July 13, 2023

Summary

This summary is machine-generated.

This study reveals how interface structure and pre-deformation influence the mechanical strength and damage behavior of FCC/BCC metallic materials. Understanding these factors is key for designing robust materials for extreme environments.

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A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens

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Published on: June 2, 2017

Area of Science:

Materials Science
Mechanical Engineering
Computational Materials Science

Background:

Structural metallic materials with immiscible interfaces offer tunable microstructures for enhanced mechanical properties.
Face-centered cubic (FCC) and body-centered cubic (BCC) phase plasticity are crucial for damage-tolerant applications, requiring high strength and thermal stability.
Understanding dynamic failure mechanisms is essential for designing materials that perform under extreme conditions.

Purpose of the Study:

To characterize plasticity contributors in various interface microstructures.
To investigate the damage evolution behavior in FCC/BCC laminate microstructures.
To elucidate the impact of pre-deformation and interface energy on dynamic failure.

Main Methods:

Utilized molecular dynamics (MD) simulations to analyze six model Copper/Tantalum (Cu/Ta) interface systems.
Examined both as-created and pre-deformed interface microstructures with varying orientation relationships.
Investigated plasticity contributions and void nucleation/evolution under different loading conditions (perpendicular and parallel to the interface).

Main Results:

Pre-existing misfit dislocations and loading orientation significantly affect the activation of slip systems.
Observed a correlation between dynamic strength and interface energy: higher strength for low-energy interfaces and lower strength for high-energy interfaces.
Pre-deformation alters dynamic strength and modifies the relationship between strength and interface energy.

Conclusions:

Interface structure, including dislocations and orientation, critically influences plastic deformation and failure mechanisms.
Interface energy is a key factor in determining dynamic strength, but its correlation can be modulated by pre-deformation.
This research provides fundamental insights for designing advanced metallic materials with tailored mechanical responses for demanding applications.