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Augmented Incremental Potential Contact for Sticky Interactions.

Yu Fang, Minchen Li, Yadi Cao

    IEEE Transactions on Visualization and Computer Graphics
    |July 14, 2023
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    Summary
    This summary is machine-generated.

    This study introduces a new simulation method for elastoplastic solids with sticky interactions, extending the Incremental Potential Contact (IPC) solver. The enhanced formulation accurately models complex adhesion behaviors, improving simulation capabilities for various geometries.

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    Area of Science:

    • Solid Mechanics
    • Computational Physics
    • Material Science

    Background:

    • Simulating elastoplastic solids with adhesion is computationally challenging.
    • Existing methods often lack robustness for complex geometries and material behaviors.
    • The Incremental Potential Contact (IPC) solver offers a promising foundation but requires extensions for adhesion.

    Purpose of the Study:

    • To develop a variational formulation for simulating sticky interactions in elastoplastic solids.
    • To extend the Incremental Potential Contact (IPC) solver to incorporate advanced adhesion models.
    • To enable robust and user-friendly simulation of complex contact phenomena.

    Main Methods:

    • Augmenting the IPC solver with the Raous-Cangemi-Cocou (RCC) adhesion model.
    • Introducing a physically parametrized normal adhesion formulation based on unsigned distance.
    • Proposing a smoothly clamped tangential adhesion model for debonding simulation.

    Main Results:

    • Robust simulation of sticky interactions for arbitrary codimensional geometries (0, 1, and 2).
    • Accurate modeling of complex adhesion behaviors, including debonding.
    • Demonstrated efficacy through benchmark studies against classical models and experimental data.

    Conclusions:

    • The proposed variational formulation significantly enhances the capabilities of the IPC solver for elastoplastic adhesion.
    • The new method provides a robust and controllable approach for simulating intricate contact scenarios.
    • This work advances the simulation of material interactions in solid mechanics.