Augmented Incremental Potential Contact for Sticky Interactions

We introduce a variational formulation for simulating sticky interactions between elastoplastic solids. Our method brings a wider range of material behaviors into the reach of the Incremental Potential Contact (IPC) solver recently developed by (Li et al. 2020). Extending IPC requires several contributions. We first augment IPC with the classical Raous-Cangemi-Cocou (RCC) adhesion model. This allows us to robustly simulate the sticky interactions between arbitrary codimensional-0, 1, and 2 geometries. To enable user-friendly practical adoptions of our method, we further introduce a physically parametrized, easily controllable normal adhesion formulation based on the unsigned distance, which is fully compatible with IPC's barrier formulation. Furthermore, we propose a smoothly clamped tangential adhesion model that naturally models intricate behaviors including debonding. Lastly, we perform benchmark studies comparing our method with the classical models as well as real-world experimental results to demonstrate the efficacy of our method.