Related Experiment Video
Updated: Jul 23, 2025
07:09
Development of Efficient OLEDs from Solution Deposition
Published on: November 4, 2022
2.2K
High-Density Integration of Ultrabright OLEDs on a Miniaturized Needle-Shaped CMOS Backplane
Sabina Hillebrandt1,2, Chang-Ki Moon1,2, Adriaan J Taal3
1Organic Semiconductor Centre, SUPA School of Physics and Astronomy, University of St Andrews, North Haugh, St Andrews, KY16 9SS, UK.
Advanced Materials (Deerfield Beach, Fla.)
|July 20, 2023
Summary
Researchers developed ultrabright, microscopic organic light-emitting diodes (OLEDs) on silicon chips for advanced displays and biomedical uses. These high-intensity, individually switchable pixels meet demanding requirements for augmented reality and optogenetics.
Area of Science:
- Materials Science
- Electrical Engineering
- Biomedical Engineering
Background:
- Direct deposition of organic light-emitting diodes (OLEDs) on silicon complementary metal-oxide-semiconductor (CMOS) chips enables high-resolution microdisplays.
- Emerging applications in augmented/virtual reality (AR/VR) and optogenetics require significantly higher light intensities than traditional displays.
- Microscopic footprint, specific shapes, and ultrastable passivation are critical for applications like brain implants.
Purpose of the Study:
- To develop ultrabright, microscopic OLEDs directly on needle-shaped CMOS chips for demanding applications.
- To optimize contact conditions for direct vacuum deposition of OLED stacks on CMOS chips.
- To achieve high optical power density for AR/VR and optogenetics.
Main Methods:
- Fabrication of up to 1024 microscopic OLEDs directly on needle-shaped CMOS chips.
- Characterization of CMOS contact pads using transmission electron microscopy and energy-dispersive X-ray spectroscopy.
- Optimization of contact interfaces via plasma treatment and silver interlayers for ohmic contact conditions.
- Direct vacuum deposition of orange- and blue-emitting OLED stacks.
Main Results:
- Achieved ohmic contact conditions facilitating direct vacuum deposition of OLEDs on CMOS chips.
- Fabricated micrometer-sized OLED pixels with individual switching capabilities.
- Generated mean optical power density of 0.25 mW/mm², exceeding 40,000 cd/m², suitable for daylight AR and optogenetics.
Conclusions:
- Successfully demonstrated direct deposition of ultrabright, microscopic OLEDs on CMOS chips.
- The developed technology meets critical requirements for high-intensity microdisplays in AR/VR and biomedical applications.
- The high optical power density and microscopic form factor enable new possibilities for optogenetics and advanced displays.
