Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink

Area of Science:

• Thermal Management
• Materials Science
• Fluid Dynamics

Background:

• Microelectronic components face malfunctions due to heat dissipation above 373 K.
• Effective cooling systems are crucial for reliable performance of electronic devices.
• Existing cooling methods require enhancement for advanced applications.

Purpose of the Study:

• To investigate the combined effect of metal foam and nanofluids in heat sinks for microelectronic cooling.
• To analyze the impact of various parameters on thermal performance and pressure drop.
• To identify optimal configurations for heat sink, metal foam, and nanofluid.

Main Methods:

• A 3D numerical model of a BCC-unit cell metal foam integrated with a rectangular-finned heat sink was developed.
• Simulations were performed for turbulent flow (Reynolds number 2100-6500).
• Parameters analyzed included fin dimensions, metal foam properties (material, porosity, pore density), and nanofluid characteristics (volume fraction, nanoparticle material, flow rate).

Main Results:

• Metal foam integration significantly enhanced heat sink thermal performance compared to heat sinks alone.
• Nanofluids demonstrated superior thermal management capabilities over pure water.
• Optimal results were achieved with CuO nanofluid and high-porosity, low-pore-density metal foam, reducing base temperature from 341 K to 314 K with a 130 Pa pressure drop.

Conclusions:

• The synergistic use of metal foam, heat sinks, and nanofluids offers a promising solution for microelectronic thermal management.
• CuO nanofluid and optimized metal foam structures provide superior cooling efficiency.
• A balance between enhanced cooling and acceptable pressure drop is essential for practical applications.