Peridynamic Simulation of Particles Impact and Interfacial Bonding in Cold Spray Process

Area of Science:

• Materials Science
• Computational Mechanics
• Surface Engineering

Background:

• Cold spray is a key technology for coatings, additive manufacturing, and repairs.
• Simulating cold spray deposition accurately is challenging, especially regarding interfacial adhesion.
• Existing numerical methods often overlook the critical role of particle-substrate interactions.

Purpose of the Study:

• To develop a novel numerical approach for simulating cold spray deposition.
• To incorporate interfacial adhesion within a unified computational framework.
• To enhance the realism of cold spray simulations by modeling particle deformation, bonding, and rebound.

Main Methods:

• A peridynamics (PD)-based numerical approach was developed.
• Interfacial interactions were integrated into the constitutive model.
• Two models for adhesive contacts were proposed: a Lenard-Johns type potential and a fracture-property-derived force-stretch relation.
• Simulations were validated against finite element method (FEM) results using copper.

Main Results:

• The PD-based approach accurately simulated copper particle deformation, aligning with FEM benchmarks.
• The model successfully captured particle-substrate bonding and separation phenomena.
• Modulating adhesion energies demonstrated the approach's flexibility in simulating diverse deposition scenarios.
• The developed framework provides a unified treatment of deformation and bonding.

Conclusions:

• Peridynamics offers a robust framework for realistic cold spray simulations.
• The incorporation of interfacial adhesion is vital for accurate deposition modeling.
• This new approach advances the simulation capabilities for additive manufacturing and repair applications using cold spray.