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Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber
Seong Yeon Park1, Seung Yoon On1, Junmo Kim1
1Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea.
ACS Applied Materials & Interfaces
|August 3, 2023
Summary
A new flash electro-thermal carbon fiber heating (FE-CH) process significantly reduces power consumption and warpage in semiconductor packaging. This method offers comparable mechanical properties to traditional methods, promising lower costs and improved production yield.
Area of Science:
- Materials Science
- Semiconductor Manufacturing
- Thermal Engineering
Background:
- Current semiconductor packaging using epoxy molding compounds (EMC) faces challenges like warpage, limited processing areas, and variability, impacting cost and yield.
- Traditional hot press methods are energy-intensive and contribute to package defects.
Purpose of the Study:
- To introduce a facile and energy-efficient EMC molding process using flash electro-thermal carbon fiber heating (FE-CH).
- To develop a modified cure cycle with rapid cooling to minimize warpage in EMC/Cu bi-layer packages.
- To evaluate the performance and mechanical properties of packages produced by the FE-CH method compared to conventional techniques.
Main Methods:
- Developed a flash electro-thermal carbon fiber heating (FE-CH) device for EMC molding.
- Manufactured EMC/Cu bi-layer packages using Joule heating with the FE-CH device.
- Implemented a modified cure cycle combining conventional cure with rapid cooling via FE-CH.
- Compared power consumption, residual strain, curvature, and peel strength against conventional hot press methods.
Main Results:
- The FE-CH process achieved over 100 times reduction in power consumption compared to conventional hot pressing (32.87 kW vs. 3.17 MW).
- FE-CH cured packages demonstrated equivalent mechanical properties (degree of cure, elastic modulus, bonding temperature, residual strain, peel strength) to hot press cured specimens.
- The modified cure cycle resulted in a 31% reduction in residual strain, 32% reduction in curvature, and a 47% increase in peel strength.
Conclusions:
- The FE-CH molding process offers a highly energy-efficient and effective alternative for semiconductor packaging.
- The modified cure cycle significantly reduces warpage and enhances mechanical performance, particularly peel strength.
- This innovative method holds significant promise for reducing semiconductor package costs and improving production yield.
