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Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints

Zhigang Li1, Kai Cheng2, Jiajun Liu2

  • 1School of Electronic Engineering and Automation, Hefei University of Technology, Hefei 230009, China.

Materials (Basel, Switzerland)
|August 12, 2023
PubMed

Keywords:
Ni-xCu/Sn soldering jointsintermetallic compoundsmechanical propertiessolid-state reactionthermal aging

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