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Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module
Hanyang Xu1, Jiabo Huang1, Wenchao Tian1
1School of Electro-Mechanical Engineering, Xidian University, Xi'an 710071, China.
Micromachines
|August 26, 2023
Summary
This study optimized microchannel cooling plates for silicon carbide IGBT power modules, significantly reducing chip temperatures. However, adding a micropump unexpectedly increased temperatures due to fluid flow resistance.
Area of Science:
- Thermal management in power electronics
- Microfluidics and heat transfer
Background:
- High operating temperatures of Insulated-Gate Bipolar Transistor (IGBT) power modules reduce reliability in integrated electronic components.
- Effective thermal analysis and cooling are crucial for enhancing IGBT module performance.
Purpose of the Study:
- To investigate the heat dissipation of an integrated microchannel cooling plate for silicon carbide IGBT power modules.
- To analyze the impact of a BL series micropump on the cooling plate's efficiency.
- To optimize microchannel cooling plate design for improved thermal performance.
Main Methods:
- Equivalent modeling of the IGBT power module.
- Thermal performance analysis of a microchannel cooling plate with main and secondary channels.
- Design of Experiments (DOE) with orthogonal simulations varying microchannel width, secondary inlet count, and inlet diameter.
- Analysis of cooling plate performance with and without a BL series micropump.
Main Results:
- The microchannel cooling plate effectively reduces IGBT chip temperatures.
- Increasing microchannel width, secondary inlets, and inlet diameter leads to lower chip junction temperatures.
- Optimal design parameters (0.58 mm width, 13 inlets, 3.8 mm diameter) reduced chip junction temperature from 677 °C to 77.7 °C.
- Incorporating a BL series micropump increased chip junction temperature to 110 °C due to increased flow resistance.
Conclusions:
- Optimized microchannel cooling plate designs significantly enhance heat dissipation in IGBT modules.
- Micropumps can negatively impact cooling efficiency by increasing fluid flow resistance.
- This research provides a basis for designing advanced cooling solutions for power electronic devices.
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