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Toward Three-Dimensional Printed Thermal Conductive Polymeric Composites Using a Binary-Composite Hybrid Based on
Hadis Khakbaz1,2,3, Sepidar Sayyar1, Stephen Beirne1
1ARC Centre of Excellence for Electromaterials Science & Intelligent Polymer Research Institute, Innovation Campus, University of Wollongong, NSW, 2500, Australia.
Macromolecular Rapid Communications
|September 4, 2023
Summary
This study developed a 3D-printable composite using boron nitride (BN) and micro-diamond (D) fillers in polyurethane (PU) for enhanced thermal conductivity and mechanical strength in flexible electronics.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Effective thermal management is crucial for microelectronic devices.
- Polymeric composites offer potential for heat dissipation but often lack mechanical robustness or printability.
- Developing flexible, self-supporting, and thermally conductive materials is a key challenge.
Purpose of the Study:
- To create a novel, 3D-printable, thermally conductive, and mechanically robust hybrid composite.
- To investigate the synergistic effects of boron nitride (BN) nanoparticles and micro-diamond (D) fillers in a polyurethane (PU) matrix.
- To evaluate the suitability of the developed composite for flexible and stretchable microelectronic applications.
Main Methods:
- Fabrication of a binary-hybrid composite using boron nitride nanoparticles and micro-diamond fillers within an elastomeric polyurethane matrix.
- Characterization of the composite's mechanical properties, including tensile modulus.
- Assessment of the composite's thermal conductivity.
- Evaluation of the material's 3D printability for self-supporting structures.
Main Results:
- A combination of 16.7 wt% BN and 16.7 wt% D fillers significantly improved the mechanical properties, increasing the tensile modulus by over nine times compared to neat PU.
- The hybrid composite exhibited more than a twofold enhancement in thermal conductivity relative to the neat PU matrix.
- The developed material demonstrated 3D printability, yielding a flexible and self-supporting structure.
Conclusions:
- The multiscale hybrid composite, incorporating BN and D fillers in a PU matrix, offers a promising solution for heat management in microelectronics.
- The synergistic effect of BN and D fillers leads to superior mechanical and thermal performance.
- The 3D-printable nature of this composite makes it highly suitable for flexible and stretchable electronic applications requiring efficient thermal dissipation.
