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Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures

Shih-Chi Yang1, Dinh-Phuc Tran1, Chih Chen1

  • 1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

Materials (Basel, Switzerland)
|September 9, 2023
PubMed

Keywords:
Cu-Cu direct bondingadvanced packagingelectromigrationelimination of bonding interfacerecrystallization and grain growth

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