Dinh-Phuc Tran
11PUBLICATIONS
7CO-AUTHORS

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Publications (11)
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|Jan 10, 2026
Structure-Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures.Fu-Chian Chen, Dinh-Phuc Tran, Chih Chen
|Aug 28, 2025
Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu.Jian-Yuan Huang, Dinh-Phuc Tran, Kang-Ping Lee
|May 11, 2024
Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints.Dinh-Phuc Tran, Yu-Ting Liu, Chih Chen
|Sep 09, 2023
Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures.Shih-Chi Yang, Dinh-Phuc Tran, Chih Chen
|Feb 25, 2023
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing.Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang
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