Wei-Lan Chiu
3PUBLICATIONS
6CO-AUTHORS

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Publications (3)
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|Sep 09, 2023
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints.Wei-You Hsu, Shih-Chi Yang, You-Yi Lin
|Mar 10, 2022
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee
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