Wei-Lan Chiu

3PUBLICATIONS
6CO-AUTHORS
Composite and hybrid materialsSurface properties of condensed matterMetals and alloy materials
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Publications (3)

|Aug 07, 2026
Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD.

|Sep 09, 2023
Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints.

Wei-You Hsu, Shih-Chi Yang, You-Yi Lin

|Mar 10, 2022
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee

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