Kai-Cheng Shie

4PUBLICATIONS
3CO-AUTHORS
Metals and alloy materialsElemental semiconductorsMultiphysics flows (incl. multiphase and reacting flows)Computational methods in fluid flow, heat and mass transfer (incl. computational fluid dynamics)
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Publications (4)

|Feb 25, 2023
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing.

Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang

|Oct 27, 2022
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints.

Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran

|Jul 27, 2022
Failures of Cu-Cu Joints under Temperature Cycling Tests.

Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran

|Oct 13, 2021
Failure Mechanisms of Cu-Cu Bumps under Thermal Cycling.

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li

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Frequent Collaborators

4 joint publications

Dinh-Phuc Tran

4 joint publications

Chih Chen

1 joint publications

Jihperng Leu