Structure-Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures

This study systematically investigates the thickness-dependent mechanical properties of electroplated copper foils with fine-grained (FG-Cu) and columnar nanotwinned (NT-Cu) microstructures. Tensile testing across a thickness range of 5-30 μm revealed that NT-Cu exhibits superior mechanical stability, with significantly lower reductions in both ultimate tensile strength (UTS) and yield strength (YS) compared to FG-Cu. The UTS of the 30 μm thick FG-Cu foil was measured at 651 MPa, increasing to 792 MPa at a thickness of 5 μm. In contrast, the UTS of NT-Cu foils only rose from 624 MPa at 30 μm to 663 MPa at 5 μm. A similar trend was observed for the YS. Microstructural analysis confirmed that NT-Cu maintains a stable columnar grain structure with minimal grain growth, contributing to its resistance to thickness-induced strength loss. These findings highlight NT-Cu as a promising candidate for applications requiring consistent mechanical performance across varying foil thicknesses.