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Enhanced Thermal Shock Resistance of High-Temperature Organic Adhesive by CF-SiCNWs Binary Phase Structure
Tingyu Zhao1, Zhengxiang Zhong1,2, Xuanfeng Zhang1
1MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, State Key Laboratory of Urban Water Resource and Environment, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China.
Abstract:
The development of high-temperature organic adhesive for bonding ultra-high-temperature ceramics with excellent thermal shock resistance has important significance to thermal protection systems for high-temperature environment application. In this study, high-temperature organic adhesive (HTOA) with carbon-fiber-SiC nanowires (CF-SiCNWs) binary phase enhancement structure was prepared. The method is that the SiCNWs grow on the chopped carbon-fiber surface and in the matrix of modified HTOA during high-temperature heat treatment with the help of a catalyst by a tip-growth way and with a vapor-liquid-solid (V-L-S) growth pattern. The results showed that the CF-SiCNWs binary phase enhancement structure plays a significant role in improving thermal shock resistance of high-temperature organic adhesive. The retention rate of the joint bond strength for the bonding samples after 20 cycles of thermal shock testing reaches 39.19%, which is higher than for the ones without CF, whose retain rate is only 6.78%. The shear strength of the samples with the CF-SiCNWs binary phase enhancement structure was about 10% higher than for those without the enhancement structure after 20 cycles of thermal shock.
