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Updated: Jul 16, 2025

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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
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Laser Processing and Multi-Energy Field Manufacturing of High-Performance Materials
Xiaoxiao Chen1,2,3, Yaou Zhang4, Anhai Li5
1Research Centre for Laser Extreme Manufacturing, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China.
Materials (Basel, Switzerland)
|September 9, 2023
Abstract:
The laser is one of the major inventions of the 20th century, along with atomic energy, the computer and semiconductors [...].

