Revealing the Influence of SiC Particle Size on the Hot Workability of SiCp/6013 Aluminum Matrix Composites

SiC particle (SiCp) size has been found to significantly influence the hot workability of particle-reinforced aluminum matrix composites (AMC). In this work, therefore, three types of SiCp/6013 composites with different SiCp sizes (0.7, 5 and 15 μm) were prepared and then subjected to isothermal hot compression tests. In addition, constitutive analysis, processing maps and microstructural characterizations were used to reveal the influence of SiCp size on the hot workability of SiCp/6013 composite. The results showed that the values of hot deformation activation energy Q increased with decreasing SiCp size. Specifically, at lower temperatures (e.g., 350 and 400 °C), the highest peak stress was shown in the AMC with SiCp size of 0.7 μm (AMC-0.7), while in the AMC with SiCp size of 5 μm (AMC-5) at higher temperatures (e.g., 450 and 500 °C). This is because a finer SiCp size would lead to stronger dislocation pinning and grain refinement strengthening effects, and such effects would be weakened at higher temperatures. Further, dynamic softening mechanisms were found to transform from dynamic recovery to dynamic recrystallization with increasing SiCp size, and the dynamic recrystallization occurred more easily at higher temperatures and lower strain rates. Consequently, the instability zones of the composites are all mainly located in the deformation region with lower temperature and higher strain rate, and smaller SiCp results in larger instability zones.