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A Novel Swept-Back Fishnet-Embedded Microchannel Topology.
Yan Wang1, Xiaoyue Zhang1, Xing Yang2
1School of Information and Control Engineering, Xi'an University of Architecture and Technology, Xi'an 710055, China.
Micromachines
|September 28, 2023
Summary
A novel swept-back fishnet-embedded microchannel topology significantly improves heat dissipation for active phased array antennas. This design offers enhanced thermal management, crucial for next-generation high-performance systems.
Area of Science:
- Electronics Engineering
- Thermal Management
- Antenna Technology
Background:
- Active phased array antennas are vital for radar systems but face heat dissipation challenges.
- Miniaturization and microelectronics advancements necessitate improved embedded cooling solutions.
- Effective thermal management is a key barrier to next-generation high-performance antenna development.
Purpose of the Study:
- To design and analyze a novel swept-back fishnet-embedded microchannel topology (SBFEMCT) for enhanced thermal dissipation.
- To investigate the impact of fishnet runner mesh density and layers on thermal performance.
- To provide insights for overcoming thermal bottlenecks in high-performance phased array antennas.
Main Methods:
- Development of SBFEMCT with varying mesh density ratios and fishnet runner layers.
- Establishment of microchannel models for thermal analysis.
- Characterization of chip maximum temperature (Tmax), runner maximum pressure (Pmax), and maximum velocity (Vmax).
Main Results:
- Reduced Pmax to 72.37% and 57.12% at mesh density ratios of 0.5, 0.25, and 0.125.
- Minimal change in maximum velocity observed across different fishnet runner layers.
- Small increase in maximum pressure drop with an increasing number of fishnet runner layers (0 to 4).
Conclusions:
- SBFEMCT demonstrates significant potential for effective heat dissipation in electronic components.
- The study provides valuable data for optimizing microchannel design for thermal management.
- This research offers new references for addressing thermal challenges in advanced phased array antennas.

