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Design and Characterization of 5 μm Pitch InGaAs Photodiodes Using In Situ Doping and Shallow Mesa Architecture for
Jules Tillement1,2,3, Cyril Cervera2, Jacques Baylet2
1STMicroelectronics, 850 Rue Jean Monnet, 38054 Crolles, France.
Sensors (Basel, Switzerland)
|November 25, 2023
Summary
This study details shallow-mesa photodiodes for short-wave infra-red (SWIR) sensing, achieving high quantum efficiency and low dark current density for advanced imaging applications.
Area of Science:
- Optoelectronics
- Semiconductor device physics
Background:
- Short-wave infra-red (SWIR) sensing demands high-performance photodetectors.
- Advancements in photodiode design are crucial for improved SWIR imaging capabilities.
Purpose of the Study:
- To present the comprehensive design, fabrication, and characterization of a novel shallow-mesa photodiode.
- To evaluate the performance of SWIR photodiodes with small pixel pitches.
Main Methods:
- Fabrication of shallow-mesa photodiodes with feature sizes down to 3 μm pixel pitch.
- Characterization of external and internal quantum efficiency at 1.55 μm.
- Analysis of dark current density and its temperature dependence.
- Investigation of passivation techniques and their impact on device performance using MIS capacitance.
Main Results:
- Demonstrated photodiodes capable of detecting 1.55 μm photons with pixel pitches as small as 3 μm.
- Achieved a maximum external quantum efficiency of 54% for a 5 μm pixel pitch photodiode.
- Estimated internal quantum efficiency reached 77% at 1.55 μm.
- Measured a low dark current density of 5 nA/cm² at -0.1 V and 23 °C.
Conclusions:
- The developed shallow-mesa photodiode exhibits excellent performance metrics for SWIR sensing.
- Passivation and device architecture are critical for minimizing dark current and maximizing quantum efficiency.
- The findings support the potential of these photodiodes for next-generation SWIR imaging systems.

