The Optimization and Analysis of a Triple-Fin Heterostructure-on-Insulator Fin Field-Effect Transistor with a Stacked...

The recent developments in the replacement of bulk MOSFETs with high-performance semiconductor devices create new opportunities in attaining the best device configuration with drive current, leakage current, subthreshold swing, Drain-Induced Barrier Lowering (DIBL), and other short-channel effect (SCE) parameters. Now, multigate FETs (FinFET and tri-gate (TG)) are advanced methodologies to continue the scaling of devices. Also, strain technology is used to gain a higher current drive, which raises the device performance, and high-k dielectric material is used to minimize the subthreshold current. In this work, we used stacked high-k dielectric materials in a TG n-FinFET with three fins and a 10 nm channel length, incorporating a three-layered strained silicon channel to determine the short-channel effects. Here, we replaced the gate oxide (SiO₂) with a stacked gate oxide of 0.5 nm of SiO₂ with a 0.5 nm effective oxide thickness of different high-k dielectric materials like Si₃N₄, Al₂O₃, ZrO_2, and HfO₂. It was found that the use of strained silicon and replacing only the SiO₂ device with the stacked SiO₂ and HfO₂ device was more beneficial to obtain an optimized device with the least leakage and improved drive currents.