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In Situ Transmission Electron Microscopy with Biasing and Fabrication of Asymmetric Crossbars Based on Mixed-Phased a-VOx
Published on: May 13, 2020
Silicon-van der Waals heterointegration for CMOS-compatible logic-in-memory design
Mu-Pai Lee1, Caifang Gao2, Meng-Yu Tsai3,4
1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Researchers developed a novel 2D/3D heterointegrated device for nonvolatile, reconfigurable computing-in-memory. This design overcomes silicon CMOS limitations, enabling efficient logic-in-memory operations with enhanced stability and performance.
Area of Science:
- Materials Science
- Electrical Engineering
- Computer Engineering
Background:
- Silicon CMOS-based computing-in-memory faces challenges in nonvolatility and reconfigurability for logic-in-memory applications.
- Existing designs struggle with power efficiency and complex integration.
Purpose of the Study:
- To introduce a universal design for nonvolatile, reconfigurable devices using 2D/3D heterointegration.
- To address the limitations of current computing-in-memory architectures.
Main Methods:
- Utilized van der Waals heterostacking with photo-controlled charge trapping/detrapping.
- Employed a partially top-gated energy band landscape for logic reconfigurability.
- Investigated dynamic charge fluctuations and trap levels.
Main Results:
- Achieved precise polarity tunability and logic nonvolatility.
- Demonstrated robustness at 85°C with a near-ideal subthreshold swing (80 mV dec⁻¹).
- Cascaded units into a monolithic circuit layer, showing high-gain logic gates (65 at Vdd = 0.5 V).
Conclusions:
- The 2D/3D heterointegrated design offers a promising prototype for future computing-in-memory hardware.
- This approach overcomes key design and power challenges in silicon CMOS technology.
- The developed devices exhibit excellent performance and stability for logic-in-memory operations.
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