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MOSFET: Enhancement Mode01:22

MOSFET: Enhancement Mode

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Enhancement-mode MOSFETs are pivotal components in electronics, distinguished by their capacity to act as highly efficient switches. They are part of the larger family of metal-oxide Semiconductor Field-Effect Transistors (MOSFETs). They are available in two types: p-channel and n-channel, each tailored to specific polarity operations.
In their basic form, enhancement-mode MOSFETs are typically non-conductive when the gate-source voltage (Vgs) is zero. This default 'off' state means no...
346
MOSFET01:16

MOSFET

480
The Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) plays a pivotal role in modern electronics thanks to its versatility and efficiency in controlling electrical currents. This device, also known as IGFET, MISFET, and MOSFET, has three main terminals: the Source, Drain, and Gate. MOSFETs are classified into n-channel or p-channel types based on the doping characteristics of their substrate and the source or drain regions.
In an n-MOSFET, the structure includes n-type source and drain...
480
MOSFET: Depletion Mode01:20

MOSFET: Depletion Mode

363
Depletion-mode MOSFETs represent a unique subset of MOSFET technology, functioning fundamentally differently from their enhancement-mode counterparts. Unlike enhancement MOSFETs, which require a positive gate-source voltage (Vgs) to turn on, depletion-mode MOSFETs are inherently conductive and "normally on" devices.
The primary characteristic of depletion-mode MOSFETs is their ability to conduct current between the drain and source terminals without gate bias. This inherent conductivity...
363
MOS Capacitor01:25

MOS Capacitor

793
A Metal-Oxide-Semiconductor (MOS) capacitor is a fundamental structure used extensively in semiconductor device technology, particularly in the fabrication of integrated circuits and MOSFETs (metal-oxide-semiconductor field-effect transistors). The MOS capacitor consists of three layers: a metal gate, a dielectric oxide, and a semiconductor substrate.
The metal gate is typically made from highly conductive materials such as aluminum or polysilicon. Beneath the metal gate lies a thin layer of...
793
Biasing of P-N Junction01:16

Biasing of P-N Junction

547
The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
547
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

352
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
352

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Related Experiment Video

Updated: Jul 9, 2025

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
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N-Channel MOSFET Reliability Issue Induced by Visible/Near-Infrared Photons in Image Sensors.

Chun-Hsien Liu1, Sheng-Di Lin1

  • 1Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu 300, Taiwan.

Sensors (Basel, Switzerland)
|December 9, 2023
PubMed
Summary
This summary is machine-generated.

High-threshold MOSFETs in image sensors degrade under visible light due to photo-induced hot electrons. This reliability issue, causing current degradation, can be mitigated by specific bias conditions or reduced photon energy.

Keywords:
CMOS image sensorlight-induced reliabilityparasitic BJT actionsingle-photon avalanche diode (SPAD)transistor degradation

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Area of Science:

  • Solid-state device physics
  • Image sensor technology
  • Semiconductor reliability

Background:

  • Single-photon avalanche diode (SPAD) arrays commonly use high-threshold MOSFETs in readout circuits.
  • These transistors are susceptible to reliability issues under specific operating conditions.

Purpose of the Study:

  • To investigate the reliability issues of high-threshold n-channel MOSFETs under visible light exposure.
  • To understand the underlying mechanisms of device degradation in image sensor applications.

Main Methods:

  • Applied specific stress conditions to high-threshold n-channel MOSFETs.
  • Measured drain current (Id) variations as a function of gate voltage.
  • Analyzed the impact of photo-induced hot electrons on device performance.

Main Results:

  • Observed significant reliability issues in high-threshold MOSFETs exposed to strong visible light.
  • Photo-induced hot electrons create interface trap states, degrading Id by increasing off-state current (Ioff) and decreasing on-state current (Ion).
  • Increased Ioff can activate parasitic bipolar junction transistors (BJTs).

Conclusions:

  • The reliability issue in high-threshold MOSFETs is attributed to photo-induced hot electron effects.
  • Mitigation strategies include forming an inversion layer under appropriate bias or reducing incident photon energy.
  • Findings are crucial for designing robust SPAD image sensors.