Silver Shell Thickness-Dependent Conductivity of Coatings Based on Ni@Ag Core@shell Nanoparticles

Ink based on metallic nanoparticles has been widely used so far for the fabrication of electronic circuits and devices using printing technology. This study aimed at the analysis of the effect of the silver shell thickness of nickel@silver core@shell (Ni@Ag) nanoparticles (NPs) on the fabrication and conductive properties of deposited coatings.

The process of the synthesis of Ni@Ag NPs with various silver shell thicknesses was developed. The physicochemical properties (size, stability against aggregation process) of synthesized Ni@Ag nanoparticles were analyzed. The films based on ink containing Ni@Ag NPs with different silver shell thicknesses were fabricated and sintered in a temperature range of 120-300 °C and at times from 15 to 90 min. The dependence of their conductive properties on the applied temperature and time as well as silver shell thickness was evaluated.

Ni NPs were coated with 10, 20, 30, 35, 45, and 55 nm silver shell thickness. The resistivity of coatings based on obtained NPs depends on the thickness of the Ag shell and the sintering temperature. After sintering at 300 °C, the highest decrease in its value (at an optimal sintering time of 60 min) from about 100 µΩ·cm to 9 µΩ·cm was observed when the thickness of the shell increased from 10 to 55 nm. At the lowest sintering temperature (120 °C) the highest conductivity (about 50% of that for bulk nickel) was obtained for films based on Ni@Ag NPs with 45 and 55 nm of the silver shell thickness.

The analysis of the resistivity of the sintered films showed that higher conductivity was obtained for the coatings formed from Ni@Ag NPs with the thicker Ag shell; moreover, thicker shells allowed a lowering of sintering temperature due to higher conductivity and a lower melting point of silver in comparison to nickel NPs.