Genome-wide screening of m6A profiling of cutaneous wound healing in diabetic mice

Junjie Shen1, Hua Chen2, Jiezhi Dai3

  • 1Department of Orthopedic Surgery, Shanghai Sixth People's Hospital, JiaoTong University, Shanghai, China.

Molecular Biology Reports
|January 22, 2024
PubMed
Abstract

Insights

This study profiled RNA modifications in diabetic mouse wounds, revealing altered m6A enzyme levels and gene expression. These findings offer new molecular insights into impaired diabetic wound healing.

Area of Science:

  • Biochemistry
  • Molecular Biology
  • Wound Healing Research

Background:

  • Diabetes mellitus (DM) significantly impairs wound healing, posing a major health challenge.
  • Understanding the molecular mechanisms underlying impaired diabetic wound healing is crucial for developing effective treatments.

Purpose of the Study:

  • To systematically profile the N6-methyladenosine (m6A) modification landscape in cutaneous wounds of a diabetic mouse model.
  • To investigate the differential expression of m6A-related enzymes and transcripts in diabetic wounds.

Main Methods:

  • Diabetes was induced in mice using streptozotocin (STZ).
  • Full-thickness skin wounds were created and analyzed after five days.
  • Western blot was used to assess m6A enzyme expression.
  • MeRIP-seq and RNA-seq were employed for genome-wide m6A profiling.

Main Results:

  • Key m6A 'eraser' enzyme ALKBH5 was upregulated, while 'writer' enzymes (METTL3, METTL14, WTAP) were downregulated in diabetic wounds.
  • 1335 differentially expressed m6A peaks were identified (558 upregulated, 777 downregulated).
  • Distinct patterns of hypomethylation and hypermethylation were observed at gene and transcript levels.

Conclusions:

  • This study provides the first comprehensive m6A landscape analysis in a diabetic wound animal model.
  • The findings offer novel insights into the molecular mechanisms of diabetic wound healing.
  • m6A modifications represent potential therapeutic targets for improving diabetic wound healing.