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A Novel 6500 V SiC Trench MOSFET with Integrated Unipolar Diode for Improved Third Quadrant and Switching
Hao Wu1, Xuan Li1, Xiaochuan Deng1
1State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China.
Abstract:
A 6500 V SiC trench MOSFET with integrated unipolar diode (UD-MOS) is proposed to improve reverse conduction characteristics, suppress bipolar degradation, and reduce switching loss. An N type base region under the trench dummy gate provides a low barrier path to suppress hole injection during the reverse conduction operation. The reverse conduction voltage VON is reduced to 1.11 V, and the reverse recovery charge (QRR) is reduced to 1.22 μC/cm2. The gate-to-drain capacitance (CGD) and gate-to-source capacitance (CGS) of the UD-MOS are also reduced to improve switching loss due to the thick oxide layer between the trench gate and dummy gate. The proposed device exhibits an excellent loss-related figure of merit (FOM). It provides a high-voltage SiC MOSFET prototype with potential performance advantages for voltage source converter-based high voltage direct current applications.
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